Datasheet

2011-2013 Microchip Technology Inc. DS20002276C-page 13
MCP1754/MCP1754S
Note 1: Unless otherwise indicated
V
R
= 3.3V, C
OUT
= 1 µF Ceramic (X7R), C
IN
= 1 µF Ceramic (X7R), I
L
= 1 mA,
T
A
= +25 °C, V
IN
= V
R
+ 1V or V
IN
= 3.6V (whichever is greater), SHDN = V
IN
, package = SOT-223.
2: Junction Temperature (T
J
) is approximated by soaking the device under test to an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in junction
temperature over the ambient temperature is not significant.
FIGURE 2-24: Power Supply Ripple
Rejection vs. Frequency.
FIGURE 2-25: Power Supply Ripple
Rejection vs. Frequency.
FIGURE 2-26: Output Noise vs. Frequency
(3 lines, V
R
= 1.2V, 3.3V, 5.0V).
FIGURE 2-27: Power Up Timing.
FIGURE 2-28: Startup From Shutdown.
FIGURE 2-29: Short Circuit Current
Foldback.
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0.01 0.1 1 10 100 1000
PSRR (dB)
Frequency (NHz)
V
OUT
=1.8V
V
IN
=6.5V
V
INAC
= 1 Vp-p
C
IN
=0 ȝF
I
OUT
= 10 mA
I
OUT
= 150 mA
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0.01 0.1 1 10 100 1000
PSRR (dB)
Frequency (NHz)
V
OUT
=5.0V
V
IN
=6.5V
V
INAC
=1Vp-p
C
IN
=0 ȝF
I
OUT
= 160 mA
I
OUT
= 40 mA
0.001
0.010
0.100
1.000
10.000
0.01 0.1 1 10 100 1000
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Frequency (NHz)
V
OUT
=5.0V, V
IN
=6.0V
I
OUT
=50mA
V
OUT
=3.3V, V
IN
=4.3V
V
OUT
=1.8V, V
IN
=3.6V
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0.00 0.05 0.10 0.15 0.20 0.25 0.30
Output Voltage (V)
Output Current (A)
Increasing Load
Decreasing Load
V
IN
= 3.6V
V
OUT
= 1.8V