Datasheet

MCP1754/MCP1754S
DS20002276C-page 16 2011-2013 Microchip Technology Inc.
3.6 Exposed Pad (EP)
Some of the packages have an exposed metal pad on
the bottom of the package. The exposed metal pad
gives the device better thermal characteristics by
providing a good thermal path to either the PCB or heat
sink to remove heat from the device. The exposed pad
of the package is internally connected to GND.