Datasheet
MCP1754/MCP1754S
DS20002276C-page 14 2011-2013 Microchip Technology Inc.
Note 1: Unless otherwise indicated
V
R
= 3.3V, C
OUT
= 1 µF Ceramic (X7R), C
IN
= 1 µF Ceramic (X7R), I
L
= 1 mA,
T
A
= +25 °C, V
IN
= V
R
+ 1V or V
IN
= 3.6V (whichever is greater), SHDN = V
IN
, package = SOT-223.
2: Junction Temperature (T
J
) is approximated by soaking the device under test to an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in junction
temperature over the ambient temperature is not significant.
FIGURE 2-30: Short Circuit Current
Foldback.
FIGURE 2-31: Short Circuit Current
Foldback.
FIGURE 2-32: Dynamic Load Response.
FIGURE 2-33: Dynamic Load Response.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.00 0.05 0.10 0.15 0.20 0.25 0.30
Output Voltage (V)
Output Current (A)
Increasing Load
Decreasing Load
V
IN
= 4.3V
V
OUT
= 3.3V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.00 0.05 0.10 0.15 0.20 0.25 0.30
Output Voltage (V)
Output Current (A)
Increasing Load
Decreasing Load
V
IN
= 6V
V
OUT
= 5V