Datasheet

© 2007 Microchip Technology Inc. DS21991C-page 13
MCP1701A
3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 3
Lead Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.89 – 1.45
Molded Package Thickness A2 0.90 – 1.30
Standoff A1 0.00 – 0.15
Overall Width E 2.10 – 3.00
Molded Package Width E1 1.20 – 1.80
Overall Length D 2.70 – 3.10
Foot Length L 0.15 – 0.60
Foot Angle φ 0° – 30°
Lead Thickness c 0.09 – 0.26
Lead Width b 0.30 – 0.51
D
e
e1
2
1
E
E1
N
b
A
A1
A2
c
L
φ
Microchip Technology Drawing C04-130B