Datasheet
2005-2013 Microchip Technology Inc. DS20001826C-page 25
MCP1700
APPENDIX A: REVISION HISTORY
Revision C (October 2013)
The following is the list of modifications:
1. Added new package to the family (2x2 DFN-6)
and related information throughout the
document.
2. Updated thermal package resistance
information in Temperature Specifications.
3. Updated Section 3.0, Pin Descriptions.
4. Added package markings and drawings for the
2x2 DFN-6 package.
5. Added information related to the 2.8V option
throughout the document.
6. Updated Product Identification System.
7. Minor typographical changes.
Revision B (February 2007)
• Updated Packaging Information.
• Corrected Product Identification System.
• Changed X5R to X7R in Notes to DC
Characteristics, Temperature Specifications, and
Section 2.0, Typical Performance Curves.
Revision A (November 2005)
• Original Release of this Document.