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 2014-2016 Microchip Technology Inc. DS20005308C-page 1

MCP16331

Features

• Up to 96% Efficiency

• Input Voltage Range: 4.4V to 50V

• Output Voltage Range: 2.0V to 24V

• 2% Output Voltage Accuracy

• Qualification: AEC-Q100 Rev. G, Grade 1

(-40°C to 125°C)

• Integrated N-Channel Buck Switch: 600 m

• Minimum 500 mA Output Current Over All Input

Voltage Ranges (see

Figure 2-9 for Maximum

Output Current vs. V

)

- Up to 1.2A output current at 3.3V and 

5V V

OUT

, V

> 12V, SOT-23 package at

+25°C ambient temperature

- Up to 0.8A output current at 12V V

OUT

> 18V, SOT-23 package at 

+25°C ambient temperature

•500 kHz Fixed Frequency

• Adjustable Output Voltage

• Low Device Shutdown Current

• Peak Current Mode Control

• Internal Compensation

• Stable with Ceramic Capacitors

• Internal Soft Start

• Internal Pull-up on EN

• Cycle-by-Cycle Peak Current Limit

• Undervoltage Lockout (UVLO): 4.1V to Start; 

3.6V to Stop

• Overtemperature Protection

• Available Package: 6-Lead SOT-23, 

8-Lead 2x3 TDFN

Applications

•PIC

MCU/dsPIC

DSC Microcontroller Bias

Supply

• 48V, 24V and 12V Industrial Input 

DC-DC Conversion

• Set-Top Boxes (STB)

• DSL Cable Modems

• Automotive

• AC/DC Adapters

• SLA Battery-Powered Devices

• AC-DC Digital Control Power Source

• Power Meters

•Consumer

• Medical and Health Care

• Distributed Power Supplies

General Description

The MCP16331 is a highly integrated, high-efficiency,

fixed frequency, step-down DC-DC converter in a popular

6-pin SOT-23 or 8-pin 2x3 TDFN package that operates

from input voltage sources up to 50V. Integrated features

include a high-side switch, fixed frequency Peak Current-

Mode control, internal compensation, peak current limit

and overtemperature protection. Minimal external com

ponents are necessary to develop a complete step-down

DC-DC converter power supply.

High converter efficiency is achieved by integrating the

current-limited, low-resistance, high-speed N-Channel

MOSFET and associated drive circuitry. High switching

frequency minimizes the size of external filtering

components, resulting in a small solution size.

The MCP16331 can supply 500 mA of continuous

current while regulating the output voltage from 2.0V to

24V. An integrated, high-performance Peak Current-

Mode architecture keeps the output voltage tightly regu

lated, even during input voltage steps and output current

transient conditions that are common in power systems.

The EN input is used to turn the device on and off.

While off, only a few µA of current are consumed from

the input for power shedding and load distribution

applications. This pin is internally pulled up, so the

device will start, even if the EN pin is left floating.

Output voltage is set with an external resistor divider.

The MCP16331 is offered in a space-saving 6-lead

SOT-23 and 8-lead 2x3 TDFN surface mount package.

Package Type

MCP16331

6-Lead SOT-23

MCP16331

8-Lead 2x3 TDFN*

GND

BOOST

GND

*Includes Exposed Thermal Pad (EP); see Table 3-1.

High-Voltage Input Integrated Switch Step-Down Regulator

Summary of content (44 pages)

PAGE 1
MCP16331 High-Voltage Input Integrated Switch Step-Down Regulator Features General Description • • • • • The MCP16331 is a highly integrated, high-efficiency, fixed frequency, step-down DC-DC converter in a popular 6-pin SOT-23 or 8-pin 2x3 TDFN package that operates from input voltage sources up to 50V. Integrated features include a high-side switch, fixed frequency Peak CurrentMode control, internal compensation, peak current limit and overtemperature protection.
PAGE 2
MCP16331 Typical Applications 1N4148 BOOST SW VIN 4.5V to 50V VIN CIN 2x10 µF CBOOST 100 nF L1 15 µH VOUT 3.3V at 500 mA 100V Schottky Diode EN COUT 2 X10 µF 20 pF Optional 31.6 k VFB GND 10 k 1N4148 BOOST SW VIN 6.0V to 50V VOUT 5.0V at 500 mA COUT 2 X10 µF 100V Schottky Diode 52.3 k VIN CIN 2x10 µF CBOOST L1 100 nF 22 µH EN 20 pF Optional VFB GND Note: 10 k EN has an internal pull-up, so the device will start even if the EN pin is left floating.
PAGE 3
MCP16331 1.0 † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† VIN, SW ...................................................
PAGE 4
MCP16331 DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VIN = VEN = 12V, VBOOST – VSW = 3.3V,  VOUT = 3.3V, IOUT = 100 mA, L = 15 µH, COUT = CIN = 2 x 10 µF X7R Ceramic Capacitors. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units VIH 1.9 — — V EN Input Logic High EN Input Logic Low Conditions VIL — — 0.4 V IENLK — 0.007 0.
PAGE 5
MCP16331 2.0 TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
PAGE 6
MCP16331 Note: Unless otherwise indicated, VIN = EN = 12V, COUT = CIN = 2 x10 µF, L = 15 µH, VOUT = 3.3V, ILOAD = 100 mA, TA = +25°C, 6-Lead SOT-23 package. 100 0.83 IOUT = 500 mA 90 IOUT = 100 mA Feedback Voltage (V) Efficiency (%) 80 70 60 50 IOUT = 10 mA 40 30 20 0.82 0.81 0.8 VIN =12V VOUT = 3.3V IOUT = 100 mA 0.79 10 0.78 0 14 18 22 26 FIGURE 2-7: 30 34 VIN (V) 38 42 46 -40 -25 -10 5 50 12V VOUT Efficiency vs. VIN.
PAGE 7
MCP16331 Note: Unless otherwise indicated, VIN = EN = 12V, COUT = CIN = 2 x10 µF, L = 15 µH, VOUT = 3.3V, ILOAD = 100 mA, TA = +25°C, 6-Lead SOT-23 package. 0.8 3.295 Switch RDSON (Ω) 0.75 0.7 VIN = 6V VOUT= 3.3V VOUT(V) 0.65 VOUT = 3.3V IOUT=100 mA 3.29 0.6 3.285 3.28 0.55 0.5 3.275 0.45 3.27 0.4 2.5 3 3.5 4 VBOOST (V) FIGURE 2-13: 4.5 5 5 5.5 Switch RDSON vs. VBOOST. 20 25 VIN(V) 30 35 40 45 50 VOUT vs. VIN. 1.2 4.
PAGE 8
MCP16331 Note: Unless otherwise indicated, VIN = EN = 12V, COUT = CIN = 2 x10 µF, L = 15 µH, VOUT = 3.3V, ILOAD = 100 mA, TA = +25°C, 6-Lead SOT-23 package. Switching Frequency (kHz) 525 1.9 VOUT = 3.3V No Load Input Current (mA) 1.7 1.5 1.3 1.1 0.9 0.7 0.5 5 10 15 FIGURE 2-19: VIN. 20 25 30 VIN (V) 35 40 45 475 VIN = 12V VOUT = 3.3V IOUT = 200 mA 450 50 Input Quiescent Current vs. 500 -40 -25 -10 FIGURE 2-22: Temperature.
PAGE 9
MCP16331 Note: Unless otherwise indicated, VIN = EN = 12V, COUT = CIN = 2 x10 µF, L = 15 µH, VOUT = 3.3V, ILOAD = 100 mA, TA = +25°C, 6-Lead SOT-23 package. VIN = 12V VOUT = 3.3V IOUT = 300 mA VOUT 20 mV/div AC coupled VIN = 12V VOUT = 3.3V IOUT = 200 mA VOUT 1V/div IL 200 mA/div EN 2V/div SW 10V/div 2 µs/div FIGURE 2-24: Waveforms. 80 µs/div Heavy Load Switching VIN = 48V VOUT = 3.3V IOUT = 5 mA VOUT 20 mV/div AC coupled FIGURE 2-27: Start-up from EN. VIN = 12V VOUT = 3.
PAGE 10
MCP16331 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP16331 Symbol Description 6 SW Output switch node. Connects to the inductor, freewheeling diode and the bootstrap capacitor. 2 4 EN Enable pin. There is an internal pull-up on the VIN. To turn the device off, connect EN to GND. 3 — NC Not connected. 4 — NC Not connected. 5 2 GND Ground pin. 6 3 VFB Output voltage feedback pin.
PAGE 11
MCP16331 NOTES:  2014-2016 Microchip Technology Inc.
PAGE 12
MCP16331 4.0 DETAILED DESCRIPTION 4.1 Device Overview 4.1.3 EXTERNAL COMPONENTS External components consist of: The MCP16331 is a high input voltage step-down regulator, capable of supplying 500 mA to a regulated output voltage, from 2.0V to 24V. Internally, the trimmed 500 kHz oscillator provides a fixed frequency, while the Peak Current-Mode control architecture varies the duty cycle for output voltage regulation.
PAGE 13
MCP16331 VIN BG REF CIN VOUT VREG SS Overtemperature VREF 500 kHz Osc RTOP RBOT – VOUT PWM Latch Comp + RCOMP VREF CBOOST S + Amp – FB EN Boost BOOST Diode Boost Precharge Charge SW R Precharge Overtemp + + CCOMP + – HS Drive SHDN All Blocks GND Schottky Diode COUT CS RSENSE Slope Comp GND Note: EN has an internal pull-up, so the device will start even if the EN pin is left floating. FIGURE 4-1: 4.2 4.2.1 MCP16331 Block Diagram.
PAGE 14
MCP16331 IL VOUT SW VIN + – Schottky Diode L COUT IOUT IL 0 VIN VOUT SW on off on on off Continuous Inductor Current Mode IL 0 IOUT VIN SW on off on off on Discontinuous Inductor Current Mode FIGURE 4-2: 4.2.2 Step-Down Converter. PEAK CURRENT MODE CONTROL The MCP16331 integrates a Peak Current-Mode control architecture, resulting in superior AC regulation while minimizing the number of voltage loop compensation components and their size for integration.
PAGE 15
MCP16331 4.2.5 ALTERNATIVE BOOST BIAS For low-voltage output applications with unregulated input voltage, a shunt regulator derived from the input can be used to derive the boost supply. For applications with high output voltage or regulated high input voltage, a series regulator can be used to derive the boost supply. In case the boost is biased from an external source while in shutdown, the device will draw slightly higher current. For 3.0V to 5.
PAGE 16
MCP16331 Shunt boost supply regulation is used for low output voltage converters operating from a wide ranging input source. A regulated 3.0V to 5.5V supply is needed to provide high-side drive bias. The shunt uses a Zener diode to clamp the voltage within the 3.0V to 5.5V range using the resistance shown in Figure 4-3. To calculate the shunt resistance, the maximum IBOOST and IZ current are used at the minimum input voltage (Equation 4-2).
PAGE 17
MCP16331 5.0 APPLICATION INFORMATION 5.1 Typical Applications The MCP16331 step-down converter operates over a wide input voltage range, up to 50V maximum. Typical applications include generating a bias or VDD voltage for the PIC® microcontroller product line, digital control system bias supply for AC-DC converters, 24V industrial input and similar applications. 5.2 Adjustable Output Voltage Calculations To calculate the resistor divider values for the MCP16331, Equation 5-1 can be used.
PAGE 18
MCP16331 5.4 Input Capacitor Selection 5.6 Inductor Selection The step-down converter input capacitor must filter the high input ripple current as a result of pulsing or chopping the input voltage. The MCP16331 input voltage pin is used to supply voltage for the power train and as a source for internal bias. A low Equivalent Series Resistance (ESR), preferably a ceramic capacitor, is recommended. The necessary capacitance is dependent upon the maximum load current and source impedance.
PAGE 19
MCP16331 ME3220-153 15 0.52 0.90 3.2x2.5x2.0 ME3220-223 22 0.787 0.71 3.2x2.5x2.0 LPS4414-153 15 0.440 0.92 4.4x4.4x1.4 LPS4414-223 22 0.59 0.74 4.4x4.4x1.4 LPS6235-153 15 0.125 2.00 6.2x6.2x3.5 LPS6235-223 22 0.145 1.7 6.2x6.2x3.5 MSS6132-153 15 0.106 1.56 6.1x6.1x3.2 MSS6132-223 22 0.158 1.22 6.1x6.1x3.2 MSS7341-153 15 0.055 1.78 6.6x6.6x4.1 MSS7341-223 22 0.082 1.42 6.6x6.6x4.1 LPS3015-153 15 0.700 0.62 3.0x3.0x1.5 LPS3015-223 22 0.825 0.5 3.
PAGE 20
MCP16331 5.7 Freewheeling Diode 5.9 The freewheeling diode creates a path for inductor current flow after the internal switch is turned off. The average diode current is dependent upon the output load current at duty cycle (D). The efficiency of the converter is a function of the forward drop and speed of the freewheeling diode. A low forward drop Schottky diode is recommended. The current rating and voltage rating of the diode is application-dependent.
PAGE 21
MCP16331 EXAMPLE 5-5: 5.11 VIN = 10V VOUT = 5.0V IOUT = 0.4A Efficiency = 90% Total System Dissipation = 222 mW LDCR = 0.15 PL = 24 mW Diode VF = 0.50 D = 50% PDiode = 125 mW MCP16331 internal power dissipation estimate: PDIS - PL - PDIODE = 73 mW JA = 198°C/W Estimated Junction = +14.5°C Temperature Rise  2014-2016 Microchip Technology Inc. PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry and switching power supplies are no different.
PAGE 22
MCP16331 Bottom Plane is GND Bottom Trace RBOT RTOP 10  MCP16331 C DB 1 B VIN VOUT D1 L 2 x CIN GND COUT COUT 4 BOOST EN GND DB 1 CB VIN 4V to 50V CIN 5 MCP16331 SW VOUT 3.3V L 6 VIN COUT D1 GND FB RTOP 3 2 Component Value CIN COUT L RTOP RBOT D1 DB CB 2 x 10 µF 2 x 10 µF 15 µH 31.2 k 10 k B1100 1N4148 100 nF 10 RBOT Note: A 10 resistor is used with a network analyzer to measure system gain and phase.
PAGE 23
MCP16331 Bottom Plane is GND MCP16331 RBOT RTOP DB VIN VOUT CB CIN GND GND COUT D1 4 BOOST EN GND DB 1 CB VIN 5 4V to 50V CIN VIN MCP16331 6 COUT D1 GND 2 Component Value CIN COUT L RTOP RBOT D1 DB CB 1 µF 10 µF 15 µH 31.2 k 10 k STPS0560Z 1N4148 100 nF FIGURE 5-2: SW VOUT 3.3V L FB 3 RTOP RBOT Compact MCP16331 SOT-23-6 D2 Recommended Layout, Low-Current Design.  2014-2016 Microchip Technology Inc.
PAGE 24
MCP16331 MCP16331 CSNUB RSNUB RTOP RBOT L CIN COUT D1 CB DB VIN VOUT GND 2 BOOST EN DB 7 CB VIN 4V to 50V CIN 8 VIN MCP16331 1 CSNUB D1 GND 5 Note: SW Component Value CIN COUT L RTOP RBOT D1 DB CB CTOP CSNUB RSNUB 2x10 µF 2x10 µF 22 µH 31.2 k 10 k MBRS1100 1N4148WS 100 nF 20 pF 430 pF 680 FB VOUT 3.3V L RSNUB 6 COUT RTOP CTOP Optional RBOT Red represents top layer pads, and traces and blue represent bottom layer pads and traces.
PAGE 25
MCP16331 6.0 TYPICAL APPLICATION CIRCUITS U1 Boost Diode BOOST CB EN L MCP16331 VIN 4.5V to 50V VOUT 3.3V SW VIN COUT FW Diode CIN GND RTOP FB RBOT Component Value Manufacturer Part Number Comment CIN 2 x 10 µF COUT 2 x 10 µF Taiyo Yuden Co., Ltd. JMK212B7106KG-T Capacitor, 10 µF, 6.3V, Ceramic, X7R, 0805, 10% 15 µH Coilcraft® MSS6132-153ML MSS6132, 15 µH, Shielded Power Inductor L TDK Corporation C5750X7S2A106M230KB Capacitor, 10 µF, 100V, X7S, 2220 RTOP 31.
PAGE 26
MCP16331 U1 Boost Diode BOOST CB EN VIN 15V to 50V DZ L MCP16331 VOUT 12V SW VIN COUT FW Diode CIN GND RTOP FB RBOT Component Value Manufacturer CIN 2 x 10 µF TDK Corporation COUT 2 x 10 µF Taiyo Yuden Co., Ltd.
PAGE 27
MCP16331 DZ Boost Diode U1 BOOST CB EN 12V VIN L MCP16331 VOUT 2V SW VIN COUT FW Diode CIN GND RTOP FB RBOT Component Value Manufacturer 2 x 10 µF Taiyo Yuden Co., Ltd. JMK212B7106KG-T Capacitor, Ceramic, 10 µF, 25V, X7R, 10%, 1206 COUT 22 µF Taiyo Yuden Co., Ltd. JMK316B7226ML-T Capacitor, Ceramic, 22 µF, 6.3V, X7R, 1206 L 10 µH Coilcraft® MSS4020-103ML 10 µH Shielded Power Inductor RTOP 15 k Panasonic® - ECG ERJ-3EKF1502V Resistor, 15.
PAGE 28
MCP16331 Boost Diode DZ CZ U1 BOOST RZ CB EN VIN L MCP16331 2.5V VIN 10V to 16V VOUT SW COUT FW Diode CIN GND RTOP FB RBOT Component Value Manufacturer 2 x 10 µF Taiyo Yuden Co., Ltd. JMK212B7106KG-T Capacitor, Ceramic, 10 µF, 25V, X7R, 10%, 1206 COUT 22 µF Taiyo Yuden Co., Ltd. JMK316B7226ML-T Capacitor, Ceramic, 22 µF, 6.3V, X7R, 1206 L 12 µH Coilcraft® LPS4414-123MLB LPS4414, 12 µH, Shielded Power Inductor 21.5 k Panasonic® - ECG ERJ-3EKF2152V Resistor, 21.
PAGE 29
MCP16331 U1 Boost Diode EN BOOST CB L VIN MCP16331 3.3V VIN 4V to 50V VOUT SW COUT FW Diode CIN GND RTOP FB RBOT Component CIN Value 2 x 10 µF Manufacturer Part Number Comment TDK Corporation C5750X7S2A106M230KB Capacitor, 10 µF, 100V, X7S, 2220 COUT 10 µF Taiyo Yuden JMK107BJ106MA-T L 15 µH Coilcraft® LPS3015-153MLB Inductor Power, 15 µH, 0.61A, SMD 31.6 k Panasonic® - ECG ERJ-2RKF3162X Resistor, 31.6 KΩ, 1/10W, 1%, 0402, SMD Resistor, 10.
PAGE 30
MCP16331 7.0 NON-TYPICAL APPLICATION CIRCUITS For additional information, please refer to the Application Note: AN2102 “Designing Applications with MCP16331 High-Input Voltage Buck Converter” (DS00002102), which can be found on the www.microchip.com web site. DB U1 BST VIN 9V-16V L 22 µH VIN SW CIN 2 x 10 µF OFF ON RT 52.3 k COUT 2 x 10 µF FB EN RB 10 k GND Component GND D 2A, 60V MCP16331 GND 1N4148 CB 0.
PAGE 31
MCP16331 CB 0.1 µF U1 VIN 4.5V-18V BST VIN D3 DZ 1N4148 7V5 L 56 µH SW CIN 2 x 10 µF R1 MCP16331 4.
PAGE 32
MCP16331 VOUT1S 5V D1 L1B(1) 10 µH U1 C2 1 µF C1 10 µF GND SGND CB 1N4148 0.1 µF BST VIN SW MCP16331 ON 10 µH D2 2A, 60V Component CIN COUT, C1 C2, C3 L1 RT RB D1 D2 DB CB U1 U2 RT 52.3 k COUT 2 x 10 µF FB EN RB 10 k GND Note 1: 2: VOUT 5V L1A(1) CIN 2 x 10 µF OFF C3 1 µF SGND DB U2 VIN 10V-40V VOUT2S 3.3V VOUT VIN MCP1755 L1A and L1B are mutually coupled.
PAGE 33
MCP16331 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 6-Lead SOT-23 Example MF25 XXNN 8-Lead TDFN (2x3x0.75 mm) Example ACD 615 25 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free.
PAGE 34
MCP16331 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 2X 0.15 C A-B D e1 A D E 2 E1 E E1 2 2X 0.15 C D 2X 0.20 C A-B e 6X b B 0.20 C A-B D TOP VIEW C A A2 SEATING PLANE 6X A1 0.
PAGE 35
MCP16331 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Leads e Pitch Outside lead pitch e1 Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Footprint L1 Seating Plane to Gauge Plane L1 φ Foot Angle c Lead Thickness Lead Width b MIN 0.90 0.
PAGE 36
MCP16331 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging GX Y Z C G G SILK SCREEN X E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X3) Y Contact Pad Length (X3) G Distance Between Pads Distance Between Pads GX Z Overall Width MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.10 1.70 0.
PAGE 37
MCP16331 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C C (A3) A SEATING PLANE 8X 0.08 C A1 SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 0.
PAGE 38
MCP16331 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 39
MCP16331 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 40
MCP16331 NOTES: DS20005308C-page 40  2014-2016 Microchip Technology Inc.
PAGE 41
MCP16331 APPENDIX A: REVISION HISTORY Revision C (December 2016) The following is a list of modifications: 1. 2. 3. Updated Section 6.0 “Typical Application Circuits”. Added Section 7.0 “Non-Typical Application Circuits”. Minor typographical corrections. Revision B (October 2014) The following is a list of modifications: 1. Added edits to incorporate the AEC-Q100 qualification. Revision A (June 2014) • Original release of this document.  2014-2016 Microchip Technology Inc.
PAGE 42
MCP16331 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO.
PAGE 43
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 44
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