Datasheet

MCP1631/HV/MCP1631V/VHV
DS22063B-page 8 © 2008 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Line Regulation ΔV
OUT
/
(V
OUT
XΔ
V
IN
)
-0.3 ±0.1 +0.3 %/V (V
OUT(MAX)
+ V
DROPOUT(MAX)
) ≤
V
IN
≤ 16V Note 2
Load Regulation ΔV
OUT
/
V
OUT
-2.5 ±1.0 +2.5 % I
L
= 1.0 mA to 250 mA, Note 4
Dropout Voltage
Note 2, Note 5
V
DROPOUT
— 330 650 mV I
L
= 250 mA, V
R
= 5.0V
— 525 725 mV I
L
= 250 mA, V
R
= 3.3V
Output Delay Time T
DELAY
— 1000 — µs V
IN
= 0V to 6V, V
OUT
= 90% V
R
,
R
L
= 50Ω resistive
Output Noise e
N
—8—µV/
(Hz)
1/2
I
L
= 50 mA, f = 1 kHz, C
OUT
=
1µF
Power Supply Ripple Rejection
Ratio
PSRR — 44 — dB f = 100 Hz, C
OUT
= 1 µF,
I
L
= 100 µA,
V
INAC
=100 mV pk-pk,
C
IN
= 0 µF, V
R
=1.2V
Protection Features
Thermal Shutdown T
SHD
— 150 — °C
Thermal Shutdown Hysteresis T
SHD_HYS
—18—°C
Electrical Specifications: Unless otherwise indicated, all limits are specified for: V
IN
+ 3.0V to 5.5V
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Junction Temperature
Range
T
J
-40 — +125 °C Steady State
Storage Temperature Range T
A
-65 — +150 °C
Maximum Junction Temperature T
J
— — +150 °C Transient
Package Thermal Resistances
Thermal Resistance, 20L-TSSOP θ
JA
— 90 — °C/W Typical 4 Layer board with
interconnecting vias
Thermal Resistance, 20L-SSOP θ
JA
— 89.3 — °C/W Typical 4 Layer board with
interconnecting vias
Thermal Resistance, 20L-QFN θ
JA
— 43 — °C/W Typical 4 Layer board with
interconnecting vias
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
IN
= 3.0V to 5.5V, F
OSC
= 1 MHz with 10% Duty Cycle, C
IN
= 0.1 µF,
V
DD
for typical values = 5.0V, T
A
for typical values = +25°C, T
A
= -40°C to +125°C for all minimum and maximums.
Parameters Sym Min Typ Max Units Conditions
Note 1: External Oscillator Input (OSC
IN
) rise and fall times between 10 ns and 10 µs were determined during device
characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90%
of maximum and minimum values. Not production tested. Additional timing specifications were fully characterized and
specified that are not production tested.
2: The minimum V
IN
must meet two conditions: V
IN
≥ 3.5V and V
IN
≥ (V
OUT(MAX)
+ V
DROPOUT(MAX)
).
3: TCV
OUT
= (V
OUT-HIGH
- V
OUT-LOW
) *10
6
/ (V
R
* ΔTemperature), V
OUT-HIGH
= highest voltage measured over the
temperature range. V
OUT-LOW
= lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
OUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V
OUT(MAX)
+ V
DROPOUT(MAX)
or 3.5V, whichever is greater.