User manual

MCP1630 AUTOMOTIVE INPUT BOOST
CONVERTER DEMO BOARD USER’S GUIDE
© 2007 Microchip Technology Inc. DS51608B-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 2
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History................................................................................... 3
Chapter 1. Product Overview
1.1 Introduction...................................................................................................... 5
1.2 What is the MCP1630 Automotive Input Boost Converter Demo Board? ....... 6
1.3 What the MCP1630 Automotive Input Boost Converter Demo Board Kit
Includes ..................................................................................................... 6
Chapter 2. Installation and Operation
2.1 Introduction...................................................................................................... 7
2.2 Features .......................................................................................................... 7
2.3 Getting Started ................................................................................................ 8
Appendix A. Schematic and Layouts
A.1 Introduction ................................................................................................... 11
A.2 Board – Schematic........................................................................................ 12
A.3 Board – Top Silk Layer ................................................................................. 13
A.4 Board – Top Metal Layer .............................................................................. 14
A.5 Board – Bottom Metal Layer ......................................................................... 15
Appendix B. Bill Of Materials (BOM)
Appendix C. Demo Board Firmware
C.1 Device Firmware........................................................................................... 19
Worldwide Sales and Service .................................................................................... 20