Datasheet

 2004-2013 Microchip Technology Inc. DS21921C-page 15
MCP1612
8-Lead Plastic Dual-Flat, No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
D2
E
A1
A
A3
TOP VIEW
EXPOSED
METAL
PAD
BOTTOM VIEW
2 1
ID INDEX
PIN 1
D
L
E2
p
b
n
AREA
(NOTE 1)
TIE BAR
(NOTE 3)
EXPOSED
ALTERNATE EXPOSED
PAD CONFIGURATIONS
(NOTE 2)
Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOM
INCHES
.026 BSC
.118 BSC
.008 REF.
.118 BSC
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
JEDEC equivalent: M0-229
See ASME Y14.5M
See ASME Y14.5M
* Controlling Parameter
Revised 07-20-05
Exposed Pad Width
Number of Pins
Contact Thickness
Overall Length
Overall Height
Exposed Pad Length
Contact Length
Contact Width
Overall Width
Notes:
Standoff
Pitch
Units
Dimension Limits
D2
L
b
E2
D
A1
A3
E
A
p
.043
.059
.008
.009
.000
.031
MIN
n
MILLIMETERS *
.061
.092
.016
.012
.001
.035
.063
.096
.020
.015
.002
.039
8
MAX
3.00 BSC
0.20 REF.
0.65 BSC
3.00 BSC
1.09
0.20
0.23
1.50
0.80
0.00
1.55
0.40
0.30
2.37
0.02
0.90
MIN NOM
8
2.45
0.50
0.37
1.60
0.05
1.00
MAX
1.
2.
3.
Drawing No. C04-062
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging