Datasheet
Table Of Contents
- 2.0 MHz, 500 mA Synchronous Buck Regulator
- Package Types
- Typical Application Circuit
- Functional Block Diagram
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- 3.0 Pin Descriptions
- 4.0 Detailed Description
- 5.0 Application Information
- 6.0 Typical Application Circuits
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Trademarks
- Worldwide Sales and Service

2007-2012 Microchip Technology Inc. DS22042B-page 5
MCP1603/B/L
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
IN
- GND.......................................................................+6.0V
All Other I/O ...............................(GND - 0.3V) to (V
IN
+ 0.3V)
L
X
to GND.............................................. -0.3V to (V
IN
+ 0.3V)
Output Short Circuit Current .................................Continuous
Power Dissipation (Note 5)..........................Internally Limited
Storage Temperature ....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM .............................................................................4 kV
MM ..............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this specifica-
tion is not intended. Exposure to maximum rating con-
ditions for extended periods may affect device
reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, V
IN
= SHDN = 3.6V, C
OUT
= C
IN
= 4.7 µF,
L = 4.7 µH, V
OUT
(ADJ) = 1.8V, I
OUT
=100mA, T
A
= +25°C. Boldface specifications apply over the T
A
range of -40°C
to +85°C.
Parameters Sym Min Typ Max Units Conditions
Input Characteristics
Input Voltage V
IN
2.7 — 5.5 V Note 1
Maximum Output Current I
OUT
500 ——mANote 1
Shutdown Current I
IN_SHDN
— 0.1 1 µA SHDN = GND
Quiescent Current - PFM I
Q
—4560 µA SHDN = V
IN
, I
OUT
= 0 mA,
device switching
Quiescent Current - PWM I
Q
1.0 2.7 4 mA SHDN = V
IN
, I
OUT
= 0 mA,
device switching (MCP1603B)
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN
, Logic Input Voltage Low V
IL
——15 %V
IN
V
IN
= 2.7V to 5.5V
SHDN
, Logic Input Voltage High V
IH
45 ——%V
IN
V
IN
= 2.7V to 5.5V
SHDN
, Input Leakage Current I
L_SHDN
-1.0 ±0.1 1.0 µA V
IN
= 2.7V to 5.5V
Undervoltage Lockout UVLO 2.12 2.28 2.43 VV
IN
Falling
Undervoltage Lockout Hysteresis UVLO
HYS
—140—mV
Thermal Shutdown T
SHD
—150— °CNote 4, Note 5
Thermal Shutdown Hysteresis T
SHD-HYS
—10—°CNote 4, Note 5
Note 1: The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
3: V
R
is the output voltage setting.
4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. T
A
, T
J
,
JA
). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
5: The internal MOSFET switches have an integral diode from the L
X
pin to the V
IN
pin, and from the L
X
pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
6: The current limit threshold is a cycle-by-cycle peak current limit.