Datasheet

2003-2013 Microchip Technology Inc. DS21762B-page 15
MCP1601
TABLE 5-4: INDUCTOR SUPPLIERS
5.5 Efficiency
Efficiency will be affected by the external component
selection and the specific operating conditions for the
application. In Section 2.0, “Typical Performance
Curves”, there are curves plotted using typical induc-
tors that can be used to estimate the converter
efficiency for 1.2V, 1.8V and 3.3V.
5.6 Printed Circuit Board Layout
The MCP1601 is capable of switching over 500 mA at
750 kHz. As with all high-frequency, switch mode,
power supplies, a good board layout is essential to pre-
venting the noise generated by the power train switch-
ing from interfering with the sensing circuitry. The
MCP1601 has not demonstrated a sensitivity to layout,
but good design practice will prevent undesired results.
FIGURE 5-2: Component Placement.
When designing a board layout for the MCP1601, the
first thing to consider is the physical placement of the
external components. In Figure 5-2, SM0805 10 µF
ceramic capacitors are used for C
IN
and C
OUT
. The
SM0603 package is used for R
1
, R
2
and C
1
. The induc-
tor used is the Coilcraft
®
LPO2506 series low profile
(0.047” high). The board outline in this example is 1” x
1”. C
IN
, L and C
OUT
are positioned around the
MCP1601 to make the high current paths as short as
possible.
Supplier L Type Area (mm)
Height
(mm)
DC
Resistance
Max.
Current
Series
Sumida
®
10 µH Unshielded 4.1 mm x 3.8 mm 3.0 mm 230 M 0.76A C32
Sumida
®
10 µH Shielded 4.0 mm x 4.0 mm 1.8 mm 160 M 0.66A CDRH3D16
Sumida
®
10 µH Shielded 5.7 mm x 5.7 mm 3.0 mm 65 M 1.3A CDRH5D28
CT* 10 µH Shielded 7.3 mm x 7.3 mm 3.5 mm 70 M 1.7A CTCDRH73
Coilcraft
®
10 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 75 M 1.0A DS1608
Coilcraft
®
15 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 90 M 0.8A DS1608
Coilcraft
®
22 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 110 M 0.7A DS1608
Coilcraft
®
10 µH Unshielded
Wafer
6.0 mm x 5.4 mm 1.3 mm 300 M 0.60A LPO6013
Coilcraft
®
15 µH Unshielded
Wafer
6.0 mm x 5.4 mm 1.3 mm 380 M 0.55A LPO6013
Taiyo
Yuden™
10 µH Shielded 5.0 mm x 5.0 mm 2.0 mm 66 M 0.7A NP04SB100M
Note: CT* = Central Technologies
MCP1601
C
IN
C
OUT
R
1
C
1
R
2
P
GND
P
GND
A
GND
A
GND
SILK