Datasheet

 2006-2012 Microchip Technology Inc. DS22019B-page 5
MCP1406/07
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V V
DD
18V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High Input Voltage V
IH
2.4 — — V
Logic ‘0’, Low Input Voltage V
IL
——0.8V
Input Current I
IN
–10 — +10 µA 0VV
IN
V
DD
Input Voltage V
IN
-5 — V
DD
+0.3 V
Output
High Output Voltage V
OH
V
DD
– 0.025 — — V DC TEST
Low Output Voltage V
OL
— — 0.025 V DC TEST
Output Resistance, High R
OH
—3.05.0 I
OUT
= 10 mA, V
DD
= 18V
Output Resistance, Low R
OL
—2.35.0 I
OUT
= 10 mA, V
DD
= 18V
Switching Time (Note 1)
Rise Time t
R
—2540nsFigure 4-1, Figure 4-2
C
L
= 2500 pF
Fall Time t
F
—2540nsFigure 4-1, Figure 4-2
C
L
= 2500 pF
Delay Time t
D1
—5065nsFigure 4-1, Figure 4-2
Delay Time t
D2
—5065nsFigure 4-1, Figure 4-2
Power Supply
Supply Voltage V
DD
4.5 — 18.0 V
Power Supply Current I
S
— 200 500 µA V
IN
= 3V
— 50 150 V
IN
= 0V
Note 1: Switching times ensured by design.
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  V
DD
 18V.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
–40 — +125 °C
Maximum Junction Temperature T
J
——+150°C
Storage Temperature Range T
A
–65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN 
JA
— 33.2 — °C/W Typical four-layer board with
vias to ground plane
Thermal Resistance, 8L-PDIP 
JA
— 125 — °C/W
Thermal Resistance, 8L-SOIC 
JA
— 155 — °C/W
Thermal Resistance, 5L-TO-220 
JA
—71 —°C/W