Datasheet

MCP1403/4/5
DS22022B-page 4 © 2007 Microchip Technology Inc.
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ V
DD
≤ 18V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High Input Voltage V
IH
2.4 — — V
Logic ‘0’, Low Input Voltage V
IL
——0.8V
Input Current I
IN
–10 — +10 µA 0V ≤ V
IN
≤ V
DD
Output
High Output Voltage V
OH
V
DD
– 0.025 — — V DC TEST
Low Output Voltage V
OL
— — 0.025 V DC TEST
Output Resistance, High R
OH
—3.16.0Ω I
OUT
= 10 mA, V
DD
= 18V
Output Resistance, Low R
OL
—3.77Ω I
OUT
= 10 mA, V
DD
= 18V
Switching Time (Note 1)
Rise Time t
R
—2540nsFigure 4-1, Figure 4-2
C
L
= 2200 pF
Fall Time t
F
—2540nsFigure 4-1, Figure 4-2
C
L
= 2200 pF
Delay Time t
D1
—5065nsFigure 4-1, Figure 4-2
Delay Time t
D2
—5065nsFigure 4-1, Figure 4-2
Power Supply
Power Supply Current I
S
—
—
2.0
0.2
3.0
0.3
mA V
IN
= 3V (Both Inputs)
V
IN
= 0V (Both Inputs)
Note 1: Switching times ensured by design.
2: Tested during characterization, not production tested.
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V
DD
≤ 18V.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
–40 — +125 °C
Maximum Junction Temperature T
J
— — +150 °C
Storage Temperature Range T
A
–65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN θ
JA
— 33.2 — °C/W Typical four-layer board with
vias to ground plane
Thermal Resistance, 8L-PDIP θ
JA
—125 —°C/W
Thermal Resistance, 8L-SOIC θ
JA
—155 —°C/W
Thermal Resistance, 16L-SOIC θ
JA
— 155 — °C/W 4-Layer JC51-7 Standard
Board, Natural Convection