Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: Rise Time vs. Supply Voltage.
- FIGURE 2-2: Rise Time vs. Capacitive Load.
- FIGURE 2-3: Rise and Fall Times vs. Temperature.
- FIGURE 2-4: Fall Time vs. Supply Voltage.
- FIGURE 2-5: Fall Time vs. Capacitive Load.
- FIGURE 2-6: Propagation Delay vs. Input Amplitude.
- FIGURE 2-7: Propagation Delay Time vs. Supply Voltage.
- FIGURE 2-8: Propagation Delay Time vs. Temperature.
- FIGURE 2-9: Quiescent Current vs. Supply Voltage.
- FIGURE 2-10: Quiescent Current vs. Temperature.
- FIGURE 2-11: Output Resistance (Output High) vs. Supply Voltage.
- FIGURE 2-12: Output Resistance (Output Low) vs. Temperature.
- FIGURE 2-13: Supply Current vs. Capacitive Load.
- FIGURE 2-14: Supply Current vs. Capacitive Load.
- FIGURE 2-15: Supply Current vs. Capacitive Load.
- FIGURE 2-16: Supply Current vs. Frequency.
- FIGURE 2-17: Supply Current vs. Frequency.
- FIGURE 2-18: Supply Current vs. Frequency.
- FIGURE 2-19: Crossover Energy vs. Supply Voltage.
- 3.0 Pin Descriptions
- 4.0 Application Information
- 5.0 Packaging Information
© 2007 Microchip Technology Inc. DS22022B-page 17
MCP1403/4/5
APPENDIX A: REVISION HISTORY
Revision B (May 2007)
• Page 13: Updated Package Outline Drawing
• Page 14: Updated Package Outline Drawing
• Page 15: Updated Package Outline Drawing
• Page 16: Updated Package Outline Drawing
• Page 17: Updated Revision History
• Page 19: Corrected Package Codes in Product
Identification System
Revision A (December 2006)
• Original Release of this Document.