Datasheet

 2006-2013 Microchip Technology Inc. DS21989B-page 17
MCP1256/7/8/9
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
.037 REFFFootprint
Notes:
Revised 09-16-05
* Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bott om
Foot Angle
Lead Width
Lead Thickness


c
B

.003
.006
–
.009
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.020 BSC
NOM
10
INCHES
0.95 REF
–
0.23
.009
.012
0.08
0.15
–
–
0.23
0.30
MILLIMETERS
*
0.50 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
10
5° 15°
5° 15°
–
–
–
0° – 8°
5° –
5° –
15°
15°
JEDEC Equivalent: MO-187 BA
8°0°
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually witho ut tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
Drawing No. C04-021
E
L
D

B
p
E1
n


A2
1
2
c
A1
A
(F)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging