Datasheet

MCP1256/7/8/9
DS21989B-page 16  2006-2013 Microchip Technology Inc.
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
E2
D
A1
A
A3
TOP VIEW
EXPOSED
METAL
PAD
BOTTOM VIEW
21
ID INDEX
PIN 1
E
L
D2
pb
n
AREA
(
NOTE 1 )
TIE BAR
(
NOTE 3 )
EXPOSED
( NOTE 2 )
K
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
INCHES
NOM
.020 BSC
.008 REF.
3. Package may have one or more exposed tie bars at ends.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
JEDEC equivalent: Not Registered
See ASME Y14.5M
See ASME Y14.5M
* Controlling Parameter
Revised 09-12-05
Standoff
Number of Pins
Overall Height
Contact Length §
Lead Width
Exposed Pad Width
Exposed Pad Length
Overall Width
Lead Thickness
Overall Length
Notes:
Pitch
Dimension Limits
(
Note 3 )
( Note 3 )
L
D2
b
E
E2
D
A1
A3
.051
.012
.008
.000
.112
.082
.112
MIN
Units
e
A
n
.031
.065
.016
.010
.001
.118
.094
.118
.067
.020
.015
.002
.124
.096
.124
MAX
.035
10
.039
0.20 REF.
0.30
0.18
1.30
0.00
2.08
2.85
2.85
0.40
0.25
1.65
0.02
3.00
3.00
2.39
0.50 BSC
MILLIMETERS
*
0.80
MIN
10
0.90
NOM
0.50
0.30
1.70
0.05
2.45
3.15
3.15
1.00
MAX
2. Exposed pad varies according to die attach paddle size.
Contact-to-Exposed Pad § K .008 — — 0.20 — —
§ Significant Characteristic
Drawing No. C04-063
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging