Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: IDD vs. Temperature (MCP111-195).
- FIGURE 2-2: IDD vs. Temperature (MCP112-300).
- FIGURE 2-3: IDD vs. Temperature (MCP112-475).
- FIGURE 2-4: IDD vs. VDD (MCP111-195).
- FIGURE 2-5: IDD vs. VDD (MCP112-300).
- FIGURE 2-6: IDD vs. VDD (MCP112-475).
- FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195).
- FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300).
- FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475).
- FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V).
- FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V).
- FIGURE 2-18: Typical Transient Response (25 °C).
- FIGURE 2-19: tRPD vs. Temperature (MCP111-195).
- FIGURE 2-20: tRPD vs. Temperature (MCP112-300).
- FIGURE 2-21: tRPD vs. Temperature (MCP112-475).
- FIGURE 2-22: tRPU vs. Temperature (MCP111-195).
- FIGURE 2-23: tRPU vs. Temperature (MCP112-300).
- FIGURE 2-24: tRPU vs. Temperature (MCP112-475).
- FIGURE 2-25: tRT vs. Temperature (MCP111-195).
- FIGURE 2-26: tRT vs. Temperature (MCP112-300).
- FIGURE 2-27: tRT vs. Temperature (MCP112-475).
- FIGURE 2-28: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP111-195).
- 3.0 PIN Description
- 4.0 Application Information
- 5.0 Packaging information
- 5.1 Package Marking Information
- 5.2 Product Tape and Reel Specifications
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2004-2013 Microchip Technology Inc. DS21889E-page 21
MCP111/112
APPENDIX A: REVISION HISTORY
Revision E (January 2013)
• Added a note to each package outline drawing.
Revision D (June 2005)
1. Added SOT-89-3 package information
throughout.
Revision C (March 2005)
The following is the list of modifications:
1. Added Section 4.4 “Using in PIC® Microcon-
troller ICSP™ Applications (MCP111 only)”
on using the MCP111 in PIC microcontroller
ICSP applications.
2. Added V
ODH
specifications in Section 1.0
“Electrical Characteristics” (for ICSP
applications).
3. Added Figure 2-28.
4. Added devices features table to page 1.
5. Updated SC-70 package markings and added
Pb-free marking information to Section 5.0
“Packaging information”.
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
1. Corrected package marking information in
Section 5.0 “Packaging information”
Revision A (May 2004)
• Original Release of this Document.