Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: IDD vs. Temperature (MCP111-195).
- FIGURE 2-2: IDD vs. Temperature (MCP112-300).
- FIGURE 2-3: IDD vs. Temperature (MCP112-475).
- FIGURE 2-4: IDD vs. VDD (MCP111-195).
- FIGURE 2-5: IDD vs. VDD (MCP112-300).
- FIGURE 2-6: IDD vs. VDD (MCP112-475).
- FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195).
- FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300).
- FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475).
- FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V).
- FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V).
- FIGURE 2-18: Typical Transient Response (25 °C).
- FIGURE 2-19: tRPD vs. Temperature (MCP111-195).
- FIGURE 2-20: tRPD vs. Temperature (MCP112-300).
- FIGURE 2-21: tRPD vs. Temperature (MCP112-475).
- FIGURE 2-22: tRPU vs. Temperature (MCP111-195).
- FIGURE 2-23: tRPU vs. Temperature (MCP112-300).
- FIGURE 2-24: tRPU vs. Temperature (MCP112-475).
- FIGURE 2-25: tRT vs. Temperature (MCP111-195).
- FIGURE 2-26: tRT vs. Temperature (MCP112-300).
- FIGURE 2-27: tRT vs. Temperature (MCP112-475).
- FIGURE 2-28: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP111-195).
- 3.0 PIN Description
- 4.0 Application Information
- 5.0 Packaging information
- 5.1 Package Marking Information
- 5.2 Product Tape and Reel Specifications
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MCP111/112
DS21889E-page 16 2004-2013 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (TT) (SOT-23)
10501050
Mold Draft Angle Bottom
10501050
Mold Draft Angle Top
0.510.440.37.020.017.015BLead Width
0.180.140.09.007.006.004
c
Lead Thickness
10501050
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.042.922.80.120.115.110DOverall Length
1.401.301.20.055.051.047E1Molded Package Width
2.642.372.10.104.093.083EOverall Width
0.100.060.01.004.002.000A1Standoff §
1.020.950.88.040.037.035A2Molded Package Thickness
1.121.010.89.044.040.035AOverall Height
1.92.076
p1
Outside lead pitch (basic)
0.96
.038
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging