Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: IDD vs. Temperature (MCP111-195).
- FIGURE 2-2: IDD vs. Temperature (MCP112-300).
- FIGURE 2-3: IDD vs. Temperature (MCP112-475).
- FIGURE 2-4: IDD vs. VDD (MCP111-195).
- FIGURE 2-5: IDD vs. VDD (MCP112-300).
- FIGURE 2-6: IDD vs. VDD (MCP112-475).
- FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195).
- FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300).
- FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475).
- FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V).
- FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V).
- FIGURE 2-18: Typical Transient Response (25 °C).
- FIGURE 2-19: tRPD vs. Temperature (MCP111-195).
- FIGURE 2-20: tRPD vs. Temperature (MCP112-300).
- FIGURE 2-21: tRPD vs. Temperature (MCP112-475).
- FIGURE 2-22: tRPU vs. Temperature (MCP111-195).
- FIGURE 2-23: tRPU vs. Temperature (MCP112-300).
- FIGURE 2-24: tRPU vs. Temperature (MCP112-475).
- FIGURE 2-25: tRT vs. Temperature (MCP111-195).
- FIGURE 2-26: tRT vs. Temperature (MCP112-300).
- FIGURE 2-27: tRT vs. Temperature (MCP112-475).
- FIGURE 2-28: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP111-195).
- 3.0 PIN Description
- 4.0 Application Information
- 5.0 Packaging information
- 5.1 Package Marking Information
- 5.2 Product Tape and Reel Specifications
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2004-2013 Microchip Technology Inc. DS21889E-page 15
MCP111/112
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
0.560.43.022.017BLead 2 Width
0.440.35.017.014
c
Lead Thickness
1.831.62.072.064D1Tab Length
4.604.40.181.173DOverall Length
2.292.13.090.084E1
Molded Package Width at Top
4.253.94.167.155HOverall Width
1.601.40.063.055AOverall Height
3.00 BSC.118 BSC
p1
Outside lead pitch (basic)
1.50 BSC.059 BSC
p
Pitch
MAXMINMAXMINDimension Limits
MILLIMETERS*INCHESUnits
shall not exceed .005" (0.127mm) per side.
Notes:
JEDEC Equivalent: TO-243
Drawing No. C04-29
*Controlling Parameter
Foot Length L .035 .047 0.89 1.20
Leads 1 & 3 Width B1 .014 .019 0.36 0.48
Molded Package Width at Base
E .090 .102 2.29 2.60
Tab Corner Radii R 0.254.010
Revised 07-24-03
p1
p
A
C
E
H
D
D1
B1
L
E1
B1
B
1
2
3
R
Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging