Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- FIGURE 2-1: IDD vs. Temperature (MCP111-195).
- FIGURE 2-2: IDD vs. Temperature (MCP112-300).
- FIGURE 2-3: IDD vs. Temperature (MCP112-475).
- FIGURE 2-4: IDD vs. VDD (MCP111-195).
- FIGURE 2-5: IDD vs. VDD (MCP112-300).
- FIGURE 2-6: IDD vs. VDD (MCP112-475).
- FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195).
- FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300).
- FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475).
- FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V).
- FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V).
- FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V).
- FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V).
- FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V).
- FIGURE 2-18: Typical Transient Response (25 °C).
- FIGURE 2-19: tRPD vs. Temperature (MCP111-195).
- FIGURE 2-20: tRPD vs. Temperature (MCP112-300).
- FIGURE 2-21: tRPD vs. Temperature (MCP112-475).
- FIGURE 2-22: tRPU vs. Temperature (MCP111-195).
- FIGURE 2-23: tRPU vs. Temperature (MCP112-300).
- FIGURE 2-24: tRPU vs. Temperature (MCP112-475).
- FIGURE 2-25: tRT vs. Temperature (MCP111-195).
- FIGURE 2-26: tRT vs. Temperature (MCP112-300).
- FIGURE 2-27: tRT vs. Temperature (MCP112-475).
- FIGURE 2-28: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP111-195).
- 3.0 PIN Description
- 4.0 Application Information
- 5.0 Packaging information
- 5.1 Package Marking Information
- 5.2 Product Tape and Reel Specifications
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2004-2013 Microchip Technology Inc. DS21889E-page 11
MCP111/112
4.0 APPLICATION INFORMATION
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a slowly
decaying power supply causes the microcontroller to
begin executing instructions without sufficient voltage to
sustain SRAM, thus producing indeterminate results.
Figure 4-1 shows a typical application circuit.
FIGURE 4-1: Typical Application Circuit.
4.1 V
TRIP
Operation
The voltage trip point (V
TRIP
) is determined on the falling
edge of V
DD
. The actual voltage trip point (V
TRIPAC
) will
be between the minimum trip point (V
TRIPMIN
) and the
maximum trip point (V
TRIPMAX
). There is a hysteresis on
this trip point to remove any “jitter” that would occur on
the V
OUT
pin when the device V
DD
is at the trip point.
Figure 4-2 shows the state of the V
OUT
pin as
determined by the V
DD
voltage. The V
TRIP
specification
is for falling V
DD
voltages. When the V
DD
voltage is
rising, the V
OUT
pin will not be driven high until V
DD
is at
V
TRIP
+ V
HYS
.
FIGURE 4-2: V
OUT
Operation as Determined by the V
TRIP
and V
HYS
.
2
MCP11X
V
DD
V
DD
V
DD
V
OUT
MCLR
(Reset Input)
V
SS
GND
PIC
®
Microcontroller
3
1
R
PU
Note 1: R
PU
may be required with the MCP111
due to the open-drain output. Resistor
R
PU
is not required with the MCP112.
0.1
µF
(1)
V
DD
V
TRIPMAX
V
TRIPMIN
V
TRIPAC
V
TRIPAC
V
TRIPAC
+ V
HYSAC
V
OUT
1V
< 1 V is outside the
device specifications