Datasheet

 2004-2013 Microchip Technology Inc. DS21906C-page 19
MCP102/103/121/131
3-Lead Plastic Transistor Outline (TO) (TO-92)
432432

Mold Draft Angle Bottom
654654

0.560.480.41.022.019.016BLead Width
0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius
4.954.644.32.195.183.170DOverall Length
4.954.714.45.195.186.175E1Overall Width
3.943.623.30.155.143.130ABottom to Package Flat
1.27.050
p
Pitch
33
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
R
n
1
3

p
L
B
A
c

1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging