Datasheet

MCP102/103/121/131
DS21906C-page 18  2004-2013 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
12°8°12°8°
b
Mold Draft Angle Bottom
12°8°12°8°
a
Mold Draft Angle Top
0.400.15.016.006BLead Width
0.250.08.010.003
c
Lead Thickness
0.410.10.016.004LFoot Length
2.251.80.089.071DOverall Length
1.351.15.053.045E1Molded Package Width
2.401.80.094.071EOverall Width
.0100.00.0004.000A1Standoff
1.000.80.039.031A2Molded Package Thickness
1.100.80.043.031AOverall Height
1.30 BSC.
p1
Outside lead pitch (basic)
0.65 BSC.
p
Pitch
33Number of Pins
MAXMINMAXMINDimension Limits
MILLIMETERS*INCHESUnits
shall not exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
*Controlling Parameter
L
B
E1
E
p
c
p1 D
1
2
3
b
a
A
A2
A1
.026 BSC.
.051 BSC.
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging