Datasheet

 2008-2014 Microchip Technology Inc. DS70000318G-page 381
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 19.0 “High-Speed 10-bit
Analog-to-Digital Converter (ADC)”
Updated Note 1 in the ADCPC0 register (see Register 19-5).
Updated Note 3 in the ADCPC1 register (see Register 19-6).
Updated Note 2 in the ADCPC2 and ADCPC3 registers (see Register 19-
7 and Register 19-8).
Section 21.0 “Special Features” Updated the second paragraph and removed the fourth paragraph in
Section 21.1 “Configuration Bits”.
Updated the Device Configuration Register Map (see Table 21-1).
Section 24.0 “Electrical
Characteristics”
Updated the Absolute Maximum Ratings for high temperature and added
Note 4.
Updated Idle Current (I
IDLE) Typical values in Table 24-6.
Updated the Typ and Max values for Parameter DI50 in the I/O Pin Input
Specifications table (see Table 24-9).
Updated the Typ and Max values for Parameters DO10 and DO27 and the
Min and Typ values for Parameter DO20 in the I/O Pin Output
Specifications (see Table 24-10).
Added parameter numbers to the Auxiliary PLL Clock Timing
Specifications (see Table 24-18).
Added parameters numbers and updated the Internal RC Accuracy Min,
Typ, and Max values (see Table 24-19 and Table 24-20).
Added parameter numbers, Note 2, updated the Min and Typ parameter
values for MP31 and MP32, and removed the conditions for MP10 and
MP11 in the High-Speed PWM Module Timing Requirements (see
Table 24-29).
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics
(see Table 24-14).
Added Parameter IM51 to the I2Cx Bus Data Timing Requirements
(Master Mode) (see Table 24-34).
Updated the Max value for Parameter AD33 in the 10-bit High-Speed
Analog-to-Digital Module Specifications (see Table 24-36).
Updated the titles and added parameter numbers to the Comparator and
DAC Module Specifications (see Table 24-38 and Table 24-39) and the
DAC Output Buffer Specifications (see Table 24-40).
TABLE A-3: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description