Datasheet

 2008-2014 Microchip Technology Inc. DS70000318G-page 379
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
Section 24.0 “Electrical
Characteristics”
Updated Typical values for Thermal Packaging Characteristics (see
Table 24-3).
Updated Min and Max values for Parameter DC12 (RAM Data Retention
Voltage) and added Note 4 (see Table 24-4).
Updated Characteristics for I/O Pin Input Specifications (see Table 24-9).
Added I
SOURCE to I/O Pin Output Specifications (see Table 24-10).
Updated Program Memory values for Parameters 136, 137, and 138
(renamed to 136a, 137a, and 138a), added Parameters 136b, 137b, and
138b, and added Note 2 (see Table 24-12).
Added Parameter OS42 (G
M) to the External Clock Timing Requirements
(see Table 24-16).
Updated Conditions for symbol T
PDLY (Tap Delay) and added symbol ACLK
(PWM Input Clock) to the High-Speed PWM Module Timing Requirements
(see Table 24-29).
Updated Parameters AD01 and AD02 in the 10-bit High-Speed Analog-to-
Digital Module Specifications (see Table 24-36).
Updated Parameters AD50b, AD55b, and AD56b, and removed
Parameters AD57b and AD60b from the 10-bit High-Speed Analog-to-Digital
Module Timing Requirements (see Table 24-37).
TABLE A-2: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description