Datasheet

 2008-2014 Microchip Technology Inc. DS70000318G-page 371
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-157D Sheet 2 of 2
0.300.20 0.25Terminal Length L
Terminal-to-Exposed Pad
REF: Reference Dimension, usually without tolerance, for information purposes only.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
Notes:
2. Package is saw singulated.
K-0.20 -
Overall Height
Overall Length
Exposed Pad Width
Number of Terminals
Terminal Width
Exposed Pad Length
Overall Width
Standoff
Pitch
E2
D2
b
D
E
A1
4.704.40 4.55
6.00 BSC
0.25
4.554.40
0.20
4.70
0.30
-
6.00 BSC
0.025 0.075
Dimension Limits
e
A
N
Units
MAX
MIN NOM
0.50 BSC
0.90
44
0.80 1.00
MILLIMETERS
Number of Terminals per Side ND 12
Number of Terminals per Side NE 10
e
e/2
44X b
0.10 C A B
0.05 C
44X L
DETAIL A
44-Terminal Very Thin Leadless Array Package (TL) – 6x6x0.9 mm Body
With Exposed Pad [VTLA]
(DATUM
A OR B)