Datasheet

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70000318G-page 370  2008-2014 Microchip Technology Inc.
B
A
0.20 C
0.20
C
C
SEATING
PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
1
2
0.10 C A B
0.10 C A
0.10
C
0.08
C
A1
Microchip Technology Drawing C04-157D Sheet 1 of 2
44-Terminal Very Thin Leadless Array Package (TL) – 6x6x0.9 mm Body
D
E
10
11 22
23
32
33N
1
2
N
(DATUM B)
(DATUM A)
NOTE 1
D2
E2
With Exposed Pad [VTLA]
(ND-1) X e
(NE-1) X e
44X K
A
DETAIL A
2X