Datasheet

 2008-2014 Microchip Technology Inc. DS70000318G-page 335

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 3.0V to 3.6V

(unless otherwise stated)

Operating temperature -40°C  TA  +150°C for High Temperature

Parameter

No.

Typical

(1)

Max Units Conditions

Power-Down Current (I

PD)

(2,4)

HDC60e 1000 2000 A +150°C 3.3V Base Power-Down Current

HDC61c 100 110 A +150°C 3.3V Watchdog Timer Current: I

WDT

(3)

Note 1: Data in the Typical column is at 3.3V, +25°C unless otherwise stated.

2: IPD (Sleep) current is measured as follows:

• CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with

external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)

• CLKO is configured as an I/O input pin in the Configuration Word

• All I/O pins are configured as inputs and pulled to V

•MCLR = VDD, WDT and FSCM are disabled

• All peripheral modules are disabled (PMDx bits are all ones)

• The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in

Sleep mode)

• JTAG disabled

3: The  current is the additional current consumed when the WDT module is enabled. This current should

be added to the base I

PD current.

4: These currents are measured on the device containing the most memory in this family.