Datasheet

© 2007 Microchip Technology Inc. Preliminary DS70165E-page 353
dsPIC33F
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Chamfers at corners are optional; size may vary.
3
. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 80
Lead Pitch e 0.50 BSC
Overall Height A – – 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 – 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 0° 3.5° 7°
Overall Width E 14.00 BSC
Overall Length D 14.00 BSC
Molded Package Width E1 12.00 BSC
Molded Package Length D1 12.00 BSC
Lead Thickness c 0.09 – 0.20
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top α 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13°
D
D1
E
E1
e
b
N
NOTE 1
123
NOTE 2
A
A2
L1
A1
L
c
α
β
φ
Microchip Technology Drawing C04-092
B