Datasheet

dsPIC30F
DS70043F-page 4 © 2005 Microchip Technology Inc.
1.3 Sensor Family
The dsPIC30F Sensor Family products (Table 1-3)
have features that support high-performance, low-cost
embedded control applications. The 18- and 28-pin
packages are designed to fit space-critical applications.
TABLE 1-3: dsPIC30F SENSOR PROCESSOR FAMILY VARIANTS
1.4 Product Identification System
Figure 1-1 illustrates the part number structure.
To order or obtain information (e.g., on pricing or
delivery), refer to the factory or a listed sales office
(sales offices and locations are listed in the back of this
document).
FIGURE 1-1: PART NUMBER STRUCTURE
Device Pins
Program
Memory
SRAM
Bytes
EEPROM
Bytes
Timer 16-bit
Input Capture
Output Compare
Std. PWM
A/D 12-bit
200 Ksps
UART
SPI™
I
2
C™
I/O Pins (<Max.)
(1)
Packages
(2)
Bytes
Instructions
dsPIC30F2011 18 12K 4K 1024 0 3 2 2 8 ch 1 1 1 12 SOG, PG
dsPIC30F3012 18 24K 8K 2048 1024 3 2 2 8 ch 1 1 1 12 SOG, PG
dsPIC30F2012 28 12K 4K 1024 0 3 2 2 10 ch 1 1 1 20 SOG, PG
dsPIC30F3013 28 24K 8K 2048 1024 3 2 2 10 ch 2 1 1 20 SOG, PG
Note 1: Maximum I/O pin count includes pins shared by the peripheral functions.
2: All 28- and 40-pin devices may be offered in ML packages in the future, depending on die size.
dsPIC30F5011AT-30I/SOG-ES
Trademark
Architecture
Flash
E = Extended High Temp -40°C to +125°C
I = Industrial -40°C to +85°C
Temperature:
Device ID
Package:
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
PG = DIP
SPG= SPDIP
SOG= SOIC
ML = QFN 6x6 or 8x8
S = Die (Waffle Pack)
W = Die (Wafers)
Memory Size in Bytes:
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Custom ID (3 digits) or
T = Tape and Reel
A,B,C… = Revision Level
Engineering Sample (ES)
Speed:
20 = 20 MIPS
30 = 30 MIPS