Datasheet

Non-PCI Single-Chip Full Duplex Ethernet Controller with Magic Packet
Datasheet
Revision 1.0 (10-24-08) Page 124 SMSC LAN91C96 5v&3v
DATASHEET
Figure 12.29 - 100 PIN TQFP Package
MIN NOMINAL MAX REMARKS
A
~ ~ 1.20 Overall Package Height
A1
0.05 ~ 0.15 Standoff
A2
0.95 ~ 1.05 Body Thickness
D
15.80 ~ 16.20 X Span
D1
13.90 ~ 14.10 X body Size
E
15.80 ~ 16.20 Y Span
E1
13.90 ~ 14.10 Y body Size
H
0.09 ~ 0.20 Lead Frame Thickness
L
0.45 0.60 0.75 Lead Foot Length
L1
~ 1.00 ~ Lead Length
e
0.50 Basic Lead Pitch
θ
0
o
~ 7
o
Lead Foot Angle
W
0.17 0.22 0.27 Lead Width
R1
0.08 ~ ~ Lead Shoulder Radius
R2
0.08 ~ 0.20 Lead Foot Radius
ccc
~ ~ 0.08 Coplanarity
Notes:
1
Controlling Unit: millimeter.
2
Tolerance on the true position of the leads is ± 0.04 mm maximum.
3
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5
Details of pin 1 identifier are optional but must be located within the zone indicated.