Datasheet

Non-PCI Single-Chip Full Duplex Ethernet Controller with Magic Packet
Datasheet
SMSC LAN91C96 5v&3v Page 123 Revision 1.0 (10-24-08)
DATASHEET
Figure 12.28 - 100 PIN QFP Package
MIN NOMINAL MAX REMARKS
A
~ ~ 3.4 Overall Package Height
A1
0.05 ~ 0.5 Standoff
A2
2.55 ~ 3.05 Body Thickness
D
23.65 ~ 24.15 X Span
D1
19.90 ~ 20.10 X body Size
E
17.65 ~ 18.15 Y Span
E1
13.90 ~ 14.10 Y body Size
H
0.11 ~ 0.23 Lead Frame Thickness
L
0.73 0.88 1.03 Lead Foot Length
L1
~ 1.95 ~ Lead Length
e
0.65 Basic Lead Pitch
θ
0
o
~ 7
o
Lead Foot Angle
W
0.20 ~ 0.40 Lead Width
R1
0.10 ~ 0.25 Lead Shoulder Radius
R2
0.15 ~ 0.40 Lead Foot Radius
ccc
~ ~ 0.10 Coplanarity
Notes:
1
Controlling Unit: millimeter.
2
Tolerance on the true position of the leads is ± 0.065 mm maximum
3
Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5
Details of pin 1 identifier are optional but must be located within the zone indicated.