Datasheet

High Performance Single-Chip 10/100 Non-PCI Ethernet Controller
Datasheet
SMSC LAN9118 131 Revision 1.5 (07-11-08)
DATASHEET
Chapter 8 Package Outline
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 8.1 100 Pin TQFP Package Definition
Table 8.1 100 Pin TQFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 1.60 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 1.35 ~ 1.45 Body Thickness
D 15.80 ~ 16.20 X Span
D1 13.90 ~ 14.10 X body Size
E 15.80 ~ 16.20 Y Span
E1 13.90 ~ 14.10 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 ~ Lead Length
e 0.50 Basic Lead Pitch
q0
o
~7
o
Lead Foot Angle
W 0.17 0.22 0.27 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity