Datasheet

LAN8720A/LAN8720AI
DS00002165B-page 66  2016 Microchip Technology Inc.
6.0 PACKAGE INFORMATION
6.1 24-QFN (Punch)
Min Nominal Max Remarks
A 0.70 0.85 1.00 Overall Package Height
A1 0 0.02 0.05 Standoff
A2 — — 0.90 Mold Cap Thickness
D/E 3.90 4.00 4.10 X/Y Body Size
D1/E1 3.55 3.75 3.95 X/Y Mold Cap Size
D2/E2 2.40 2.50 2.60 X/Y Exposed Pad Size
L 0.30 0.40 0.50 Terminal Length
b 0.18 0.25 0.30 Terminal Width
k 0.25 — — Terminal to Exposed Pad Clearance
e 0.50 BSC Terminal Pitch
Note 1: All dimen
sions are in millimeters unless otherwise noted.
2: Dimen
sion “b” applies to plated terminals and is measured between 0.15 and 0.30 mm from the terminal tip.
3: Th
e pin 1 identifier may vary, but is always located within the zone indicated.