Datasheet
Table Of Contents
- Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support
- 1.0 Introduction
- 2.0 Pin Description and Configuration
- 3.0 Functional Description
- 3.1 Transceiver
- 3.2 Auto-negotiation
- 3.3 HP Auto-MDIX Support
- 3.4 MAC Interface
- 3.5 Serial Management Interface (SMI)
- 3.6 Interrupt Management
- 3.7 Configuration Straps
- 3.8 Miscellaneous Functions
- 3.9 Application Diagrams
- 4.0 Register Descriptions
- 4.1 Register Nomenclature
- 4.2 Control and Status Registers
- TABLE 4-2: SMI Register Map
- 4.2.1 Basic Control Register
- 4.2.2 Basic Status Register
- 4.2.3 PHY Identifier 1 Register
- 4.2.4 PHY Identifier 2 Register
- 4.2.5 Auto Negotiation Advertisement Register
- 4.2.6 Auto Negotiation Link Partner Ability Register
- 4.2.7 Auto Negotiation Expansion Register
- 4.2.8 Mode Control/Status Register
- 4.2.9 Special Modes Register
- 4.2.10 Symbol Error Counter Register
- 4.2.11 Special Control/Status Indications Register
- 4.2.12 Interrupt Source Flag Register
- 4.2.13 Interrupt Mask Register
- 4.2.14 PHY Special Control/Status Register
- 5.0 Operational Characteristics
- 6.0 Package Information
- 7.0 Application Notes
- Appendix A: Data Sheet Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
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LAN8720A/LAN8720AI
DS00002165B-page 6 ļ£ 2016 Microchip Technology Inc.
2.0 PIN DESCRIPTION AND CONFIGURATION
FIGURE 2-1: 24-QFN/SQFN PIN ASSIGNMENTS (TOP VIEW)
VSS
NOTE: Exposed pad (VSS) on bottom of package must be connected to ground
LAN8720A/LAN8720Ai
(TOP VIEW)
MDIO
7
8
9
10
11
12
24
23
22
21
20
19
VDD1A
TXN
TXP
RXN
RXP
RBIAS
CRS_DV/MODE2
RXER/PHYAD0
VDDIO
RXD0/MODE0
RXD1/MODE1
Note 2-1 When a lower case ānā is used at the beginning of the signal name, it indicates that the signal is
active low. For example, nRST indicates that the reset signal is active low.
Note 2-2 The buf
fer type for each signal is indicated in the BUFFER TYPE column. A description of the buffer
types is provided in Section 2.2.