Datasheet

±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR
®
Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 78 SMSC LAN8700/LAN8700i
DATASHEET
Chapter 9 Package Outline, Tape and Reel
Figure 9.1 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
terminal tip. Tolerance on the true position of the terminal is ± 0.05 mm at maximum material
conditions (MMC).
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
Table 9.1 36-Pin QFN Package Parameters
MIN NOMINAL MAX REMARKS
A 0.80 ~ 1.00 Overall Package Height
A1 0 ~ 0.05 Standoff
A2 0.60 ~ 0.80 Mold Thickness
A3 0.20 REF Copper Lead-frame Substrate
D 5.85 ~ 6.15 X Overall Size
D1 5.55 ~ 5.95 X Mold Cap Size
D2 3.55 ~ 3.85 X exposed Pad Size
E 5.85 ~ 6.15 Y Overall Size
E1 5.55 ~ 5.95 Y Mold Cap Size
E2 3.55 ~ 3.85 Y exposed Pad Size
L 0.35 ~ 0.75 Terminal Length
e 0.50 Basic Terminal Pitch
b 0.18 ~ 0.30 Terminal Width
ccc ~ ~ 0.08 Coplanarity