Datasheet

±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR
®
Technology in a Small Footprint
Datasheet
Revision 2.3 (04-12-11) 68 SMSC LAN8700/LAN8700i
DATASHEET
Chapter 7 DC Electrical Characteristics
7.1 DC Characteristics
7.1.1 Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
7.1.1.1 Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
no change in operation or performance due to the event. All pins on the LAN8700 provide ±8kV HBM
protection.
Table 7.1 Maximum Conditions
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENT
VDD33,VDDIO Power pins to all other pins. -0.5 +3.6 V
Digital IO To VSS ground -0.5 +3.6 V Table 7.5, “MII Bus
Interface Signals,” on
page 71
VSS VSS to all other pins -0.5 +4.0 V
Operating
Temperature
LAN8700-AEZG 0 +70 C Commercial temperature
components.
Operating
Temperature
LAN8700i-AEZG -40 +85 C Industrial temperature
components.
Storage
Temperature
-55 +150 C
Table 7.2 ESD and LATCH-UP Performance
PARAMETER CONDITIONS MIN TYP MAX UNITS COMMENTS
ESD PERFORMANCE
All Pins Human Body Model ±8 kV Device
System EN/IEC61000-4-2 Contact
Discharge
±8 kV 3rd party system test
System EN/IEC61000-4-2 Air-gap
Discharge
±15 kV 3rd party system test
LATCH-UP PERFORMANCE
All Pins EIA/JESD 78, Class II 150 mA