Datasheet

ENC424J600/624J600
DS39935C-page 142  2010 Microchip Technology Inc.
17.1 DC Characteristics: ENC424J600/624J600
TABLE 17-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
ENC424J600/624J600:
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL) + ((VTPOUT+ +
V
TPOUT-)/2 x ITXCT)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 17-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-Pin QFN (8x8x1 mm) JA 28 — °C/W (Note 1)
Package Thermal Resistance, 44-Pin TQFP (10x10x1 mm) JA 49.8 — °C/W (Note 1)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm) JA 47 — °C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.