Datasheet

PIC32MX330/350/370/430/450/470
DS60001185C-page 272  2012-2013 Microchip Technology Inc.
30.1 DC Characteristics
TABLE 30-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp. Range
(in °C)
Max. Frequency
PIC32MX330/350/370/430/450/470
DC5 2.3-3.6V
(1)
-40°C to +85°C 100 MHz
DC5b 2.3-3.6V
(1)
-40°C to +105°C 80 MHz
Note 1: Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN. Refer to
parameter BO10 in
Tab le 30-10 for VBORMIN values.
TABLE 30-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
V-temp Temperature Devices
Operating Junction Temperature Range TJ -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +105 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 30-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit Notes
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm) JA 28 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm) JA 47 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm) JA 43 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm) JA 43 — °C/W 1
Package Thermal Resistance, 124-pin VTLA JA 21 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.