Datasheet

 2006-2015 Microchip Technology Inc. DS50001292W-page 83
PEP and Debug Header
Specification
Appendix A. Debug Header Target Footprints
A.1 INTRODUCTION
To connect a debug header directly to a target board (without the use of a transition
socket) the following information will be helpful.
• DIP Device Footprints
• TQFP/PLCC Device Footprints
A.2 DIP DEVICE FOOTPRINTS
The DIP device adapter footprint shown below will accept adapter plugs like Samtec
series APA plugs. These plugs can be soldered in place during development/emulation
and eliminate the need for other sockets.
FIGURE A-20: DIP FOOTPRINT
A.3 TQFP/PLCC DEVICE FOOTPRINTS
TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec
series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during
development/emulation and eliminate the need for other sockets.
FIGURE A-21: SINGLE-ROW TQFP/PLCC FOOTPRINT
0.100
C
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of DIP is 40-pin.
DIP C
8-Pin 0.300
14-Pin 0.300
18-Pin 0.300
20-Pin 0.300
28-Pin 0.300
40-Pin 0.600
0.028 DIA.
PLATED-THRU
HOLES
0.050
0.800
0.800
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
0.028 DIA
PLATED-THRU
HOLES