Datasheet

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
DS70291G-page 414 © 2007-2012 Microchip Technology Inc.
32.1 High Temperature DC Characteristics
TABLE 32-1: OPERATING MIPS VS. VOLTAGE
TABLE 32-2: THERMAL OPERATING CONDITIONS
TABLE 32-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Characteristic
V
DD Range
(in Volts)
Temperature Range
(in °C)
Max MIPS
dsPIC33FJ32MC302/304,
dsPIC33FJ64MCX02/X04 and
dsPIC33FJ128MCX02/X04
— 3.0V to 3.6V
(1)
-40°C to +150°C 20
Note 1: Device is functional at V
BORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.
Rating Symbol Min Typ Max Unit
High Temperature Devices
Operating Junction Temperature Range T
J -40 — +155 °C
Operating Ambient Temperature Range TA -40 — +150 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ - TA)/θJA W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Parameter
No.
Symbol Characteristic Min Typ Max Units Conditions
Operating Voltage
HDC10 Supply Voltage
V
DD — 3.0 3.3 3.6 V -40°C to +150°C
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.