Datasheet

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
DS70591E-page 366  2009-2012 Microchip Technology Inc.
27.1 DC Characteristics
TABLE 27-1: OPERATING MIPS vs. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610
— 3.0-3.6V
(1)
-40°C to +85°C 40
— 3.0-3.6V
(1)
-40°C to +125°C 40
Note 1: Overall functional device operation at V
BORMIN < VDD < VDDMIN is tested but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below V
DDMIN. See
Parameter BO10 in Table 27-11 for the BOR values.
TABLE 27-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 27-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm) 
JA 28 — °C/W 1
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm) 
JA 39 — °C/W 1
Package Thermal Resistance, 80-Pin TQFP (12x12x1 mm) 
JA 53.1 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm) 
JA 43 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm) 
JA 43 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.