Datasheet

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DS70292G-page 412 © 2007-2012 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e 0.65 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 6.00 BSC
Exposed Pad Width E2 3.65 3.70 4.70
Overall Length D 6.00 BSC
Exposed Pad Length D2 3.65 3.70 4.70
Contact Width b 0.23 0.38 0.43
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
D
E
2
1
N
E2
EXPOSED
PAD
2
1
D2
N
e
b
K
L
NOTE 1
A3
A
A1
TOP VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-124B