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ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller SOIC 28 16-Bit 40 null I/O number 21

 2009-2013 Microchip Technology Inc. DS80000443K-page 1

dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04 and

dsPIC33FJ128GPX02/X04

The dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/

X04 and dsPIC33FJ128GPX02/X04 family devices that

you have received conform functionally to the current

Device Data Sheet (DS70292G), except for the

anomalies described in this document.

The silicon issues discussed in the following pages are

for silicon revisions with the Device and Revision IDs

listed in Table 1. The silicon issues are summarized in

Table 2.

The errata described in this document will be addressed

in future revisions of the dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/

X04 silicon.

Data Sheet clarifications and corrections start on

page 11, following the discussion of silicon issues.

The silicon revision level can be identified using the

current version of MPLAB

IDE and Microchip’s

programmers, debuggers and emulation tools, which

are available at the Microchip corporate web site

(www.microchip.com).

For example, to identify the silicon revision level using

MPLAB IDE in conjunction with MPLAB ICD 3 or

PICkit™ 3:

1. Using the appropriate interface, connect the device

to the MPLAB ICD 3 programmer/debugger or

PICkit 3.

2. From the main menu in MPLAB IDE, select

Configure>Select Device

, and then select the

target part number in the dialog box.

3. Select the MPLAB hardware tool

(Debugger>Select Tool

4. Perform a “Connect” operation to the device

(Debugger>Connect

). Depending on the devel-

opment tool used, the part number and Device

Revision ID value appear in the Output window.

The Device and Revision ID values for the various

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04

and dsPIC33FJ128GPX02/X04 silicon revisions are

shown in Table 1.

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the

issues indicated in the last column of

Table 2 apply to the current silicon

revision (A5).

Note: If you are unable to extract the silicon

revision level, please contact your local

Microchip sales office for assistance.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and

dsPIC33FJ128GPX02/X04 Family

Silicon Errata and Data Sheet Clarification

Summary of content (16 pages)

PAGE 1
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 Family Silicon Errata and Data Sheet Clarification The dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/ X04 and dsPIC33FJ128GPX02/X04 family devices that you have received conform functionally to the current Device Data Sheet (DS70292G), except for the anomalies described in this document.
PAGE 2
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 TABLE 1: SILICON DEVREV VALUES Part Number dsPIC33FJ32GP302 0x0605 dsPIC33FJ32GP304 0x0607 dsPIC33FJ64GP202 0x0615 dsPIC33FJ64GP204 0x0617 dsPIC33FJ64GP802 0x061D dsPIC33FJ64GP804 0x061F dsPIC33FJ128GP202 0x0625 dsPIC33FJ128GP204 0x0627 dsPIC33FJ128GP802 0x062D dsPIC33FJ128GP804 0x062F Note 1: 2: Revision ID for Silicon Revision(2) Device ID(1) A1 A2 A3 A4 A5 0x3001 0x3002 0x3002 0x3003 0x3004 0x3001 0x3
PAGE 3
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 TABLE 2: SILICON ISSUE SUMMARY Module Feature Item Number Affected Revisions(1) Issue Summary A1 A2 A3 A4 A5 UART IR Mode 1. The 16x baud clock signal on the BCLK pin is present only when the module is transmitting. X X X X X UART High-Speed Mode 2. When the UARTx is in 4x mode (BRGH = 1) and using two Stop bits (STSEL = 1), it may sample the first Stop bit instead of the second one.
PAGE 4
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 TABLE 2: SILICON ISSUE SUMMARY (CONTINUED) Module Feature Item Number Affected Revisions(1) Issue Summary A1 A2 A3 A4 A5 ECAN™ Sleep Mode 16. The WAKIF bit in the CiINTF register cannot be X cleared by software instruction after the device is interrupted from Sleep due to activity on the CAN bus. X X X X ECAN Receive Operation 17. The ECAN module may not store the received data in the correct location.
PAGE 5
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 4. Module: SPI Silicon Errata Issues Note: This document summarizes all silicon errata issues from all revisions of silicon, previous as well as current. Only the issues indicated by the shaded column in the following tables apply to the current silicon revision (A5). 1.
PAGE 6
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 6. Module: I2C 9. Module: I2C If there are two I2C devices on the bus, one of them is acting as the master receiver and the other as the slave transmitter. If both devices are configured for 10-Bit Addressing mode, and have the same value in the A10 and A9 bits of their addresses, then when the slave select address is sent from the master, both the master and slave Acknowledge it.
PAGE 7
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 12. Module: UART 15. Module: PSV Operations When the UARTx is operating in 8-bit mode (PDSEL<1:0> = 0x) and using the IrDA encoder/ decoder (IREN = 1), the module incorrectly transmits a data payload of 80h as 00h. An address error trap occurs in certain addressing modes when accessing the first four bytes of a PSV page. This only occurs when using the following addressing modes: Work around • MOV.
PAGE 8
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 17. Module: ECAN 19. Module: SPI The ECAN module may not store received data in the correct location. When this occurs, the receive buffers will become corrupted. In addition, it is also possible for the transmit buffers to become corrupted. This issue is more likely to occur as the CAN bus speed approaches 1 Mbps. Work around Do not use the DMA with ECAN in Peripheral Indirect mode.
PAGE 9
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 22. Module: ADC If the ADC module is in an enabled state when the device enters Sleep mode, as a result of executing a PWRSAV #0 instruction, the device Power-Down (IPD) current may exceed the specifications listed in the device data sheet. This may happen even if the ADC module is disabled by clearing the ADON bit prior to entering Sleep mode.
PAGE 10
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 27. Module: CPU 29. Module: UART When a previous DISI instruction is active (i.e., the DISICNT register is non-zero), and the value of the DISICNT register is updated manually, the DISICNT register freezes and disables interrupts permanently. Work around Avoid updating the DISICNT register manually. Instead, use the DISI #n instruction with the required value for ‘n’.
PAGE 11
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 4. Module: Electrical Characteristics Data Sheet Clarifications For Parameter DA01 (Positive Output Differential Voltage) in Table 30-46, the minimum value is corrected to read as 0.8V. The following typographic corrections and clarifications are to be noted for the latest version of the device data sheet (DS70292G): Note: Corrections are shown in bold. Where possible, the original bold text formatting has been removed for clarity.
PAGE 12
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 7. Module: High-Temperature Electrical Characteristics A new table and specification, Table 31-11 (AC Characteristics: Internal RC Accuracy) and Parameter HF20 (Internal FRC Accuracy), are added to this chapter. They are shown below. All subsequent tables renumbered accordingly. in the chapter are TABLE 31-11: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. HF20 Note 1: Standard Operating Conditions: 3.0V to 3.
PAGE 13
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 APPENDIX A: REVISION HISTORY Rev A Document (3/2009) Initial release of this document; issued for revision A1, A2 and A3 silicon. Rev K Document (8/2013) Added data sheet clarifications 6 (Electrical Characteristics) and 7 (High-Temperature Electrical Characteristics).
PAGE 14
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04 NOTES: DS80000443K-page 14  2009-2013 Microchip Technology Inc.
PAGE 15
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 16
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