Datasheet

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
DS70283K-page 318 © 2007-2012 Microchip Technology Inc.
Section 24.0 “Electrical Characteristics” Added the 28-pin SSOP Thermal Packaging Characteristics (see
Table 24-3).
Removed Note 4 from the DC Temperature and Voltage
Specifications (see Table 24-4).
Updated the maximum value for parameter DI19 and added
parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input
Specifications (see Table 24-9).
Updated Note 3 of the PLL Clock Timing Specifications (see
Table 24-17).
Removed Note 2 from the AC Characteristics: Internal RC Accuracy
(see Table 24-18).
Updated the characteristic description for parameter DI35 in the I/O
Timing Requirements (see Table 24-20).
Updated all SPI specifications (see Table 24-32 through Table 24-39
and Figure 24-14 through Figure 24-21).
Added Note 4 to the 12-bit mode ADC Module Specifications (see
Table 24-43).
Added Note 4 to the 10-bit mode ADC Module Specifications (see
Table 24-44).
Section 25.0 “High Temperature Electrical
Characteristics”
Updated all ambient temperature and range values to +150ºC
throughout the chapter.
Updated the storage temperature and range to +160ºC.
Updated the maximum junction temperature from +145ºC to +155ºC.
Updated Note 1 in the PLL Clock Timing Specifications (see
Table 25-10).
Added Note 3 to the 12-bit Mode ADC Module Specifications (see
Table 25-17).
Added Note 3 to the 10-bit Mode ADC Module Specifications (see
Table 25-18).
Section 26.0 “Packaging Information” Added the 28-Lead SSOP package information (see Section 26.1
“Package Marking Information” and Section 26.2 “Package
Details”).
“Product Identification System” Added the “SS” definition for the SSOP package.
TABLE A-6: MAJOR SECTION UPDATES (CONTINUED)
Section Name Update Description