Datasheet

© 2007-2011 Microchip Technology Inc. DS70290J-page 255
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
TABLE 23-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (I
DD)
TABLE 23-6: DC CHARACTERISTICS: DOZE CURRENT (I
DOZE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Parameter
No.
Typical Max Units Conditions
Power-Down Current (I
PD)
(3)
HDC60e 250 2000 μA +150°C 3.3V Base Power-Down Current
(1,3)
HDC61c 3 5 μA +150°C 3.3V Watchdog Timer Current: ΔIWDT
(2,4)
Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to V
SS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
2: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base I
PD current.
3: These currents are measured on the device containing the most memory in this family.
4: These parameters are characterized, but are not tested in manufacturing.
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Parameter
No.
Typical
(1)
Max Units Conditions
HDC20 19 35 mA +150°C 3.3V 10 MIPS
HDC21 27 45 mA +150°C 3.3V 16 MIPS
HDC22 33 55 mA +150°C 3.3V 20 MIPS
Note 1: These parameters are characterized, but are not tested in manufacturing.
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature
Parameter
No.
Typical
(1)
Max
Doze
Ratio
Units Conditions
HDC72a 39 45 1:2 mA
+150°C 3.3V 20 MIPSHDC72f 18 25 1:64 mA
HDC72g 18 25 1:128 mA
Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.