Datasheet

dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
DS70290J-page 210 © 2007-2011 Microchip Technology Inc.
22.1 DC Characteristics
TABLE 22-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304
—
V
BOR-3.6V
(1)
-40°C to +85°C 40
—
V
BOR-3.6V
(1)
-40°C to +125°C
40
Note 1: Device is functional at V
BORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 22-11
for the minimum and maximum BOR values.
TABLE 22-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range TJ -40 — +155 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ - TA)/θJA W
TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-pin QFN
θJA 32 — °C/W 1
Package Thermal Resistance, 44-pin TFQP
θJA 45 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP
θJA 45 — °C/W 1
Package Thermal Resistance, 28-pin SOIC
θJA 50 — °C/W 1
Package Thermal Resistance, 28-pin SSOP
θJA 71 — °C/W 1
Package Thermal Resistance, 28-pin QFN-S
θJA 35 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.