Datasheet

dsPIC33FJXXXGPX06/X08/X10
DS70286C-page 262 © 2009 Microchip Technology Inc.
TABLE 25-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
Parameter
No.
Typical
(1)
Max Units Conditions
Power-Down Current (I
PD)
(2)
DC60d 55 500 μA -40°C
3.3V Base Power-Down Current
(3,4)
DC60a 211 500 μA +25°C
DC60b 244 500 μA +85°C
DC61d 8 13 μA -40°C
3.3V Watchdog Timer Current: ΔI
WDT
(3)
DC61a 10 15 μA +25°C
DC61b 12 20 μA +85°C
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
2: Base I
PD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS. WDT, etc., are all switched off and VREGS (RCON<8>) = 1.
3: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base I
PD current.
4: These currents are measured on the device containing the most memory in this family.
TABLE 25-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
Parameter
No.
Typical
(1)
Max Doze Ratio Units Conditions
DC73a 11 35 1:2 mA
-40°C 3.3V 40 MIPSDC73f 11 30 1:64 mA
DC73g 11 30 1:128 mA
DC70a 42 50 1:2 mA
+25°C 3.3V 40 MIPSDC70f 26 30 1:64 mA
DC70g 25 30 1:128 mA
DC71a 41 50 1:2 mA
+85°C 3.3V 40 MIPSDC71f 25 30 1:64 mA
DC71g 24 30 1:128 mA
Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated.