Datasheet

dsPIC33FJXXXGPX06/X08/X10
DS70286C-page 258 © 2009 Microchip Technology Inc.
25.1 DC Characteristics
TABLE 25-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJXXXGPX06/X08/X10
DC5 3.0-3.6V -40°C to +85°C 40
TABLE 25-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
dsPIC33FJXXXGPX06/X08/X10
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
I/O = Σ ({V
DD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ - TA)/θJA W
TABLE 25-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
θJA 40 — °C/W 1
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
θJA 40 — °C/W 1
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm) θJA 40 — °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
θJA 40 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (θJA) numbers are achieved by package simulations.