Datasheet

dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70652E-page 280  2011-2012 Microchip Technology Inc.
26.1 DC Characteristics
TABLE 26-1: OPERATING MIPS vs. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104
DC5 V
BOR-3.6V
(1)
-40°C to +85°C 16
VBOR-3.6V
(1)
-40°C to +125°C 16
Note 1: Overall functional device operation at V
BOR < VDD < VDDMIN is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below VDDMIN.
TABLE 26-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
Industrial Temperature Devices
Operating Junction Temperature Range T
J -40 — +125 °C
Operating Ambient Temperature Range T
A -40 — +85 °C
Extended Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PIO W
I/O Pin Power Dissipation:
I/O =  ({V
DD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ – TA)/JA W
TABLE 26-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 18-pin PDIP 
JA 50 — °C/W 1
Package Thermal Resistance, 20-pin PDIP 
JA 50 — °C/W 1
Package Thermal Resistance, 28-pin SPDIP JA 50 — °C/W 1
Package Thermal Resistance, 18-pin SOIC 
JA 63 — °C/W 1
Package Thermal Resistance, 20-pin SOIC 
JA 63 — °C/W 1
Package Thermal Resistance, 28-pin SOIC JA 55 — °C/W 1
Package Thermal Resistance, 20-pin SSOP 
JA 90 — °C/W 1
Package Thermal Resistance, 28-pin SSOP 
JA 71 — °C/W 1
Package Thermal Resistance, 28-pin QFN (6x6 mm) JA 37 — °C/W 1
Package Thermal Resistance, 36-pin VTLA (5x5 mm) 
JA 31.1 — °C/W 1
Package Thermal Resistance, 44-pin TQFP 
JA 45 — °C/W 1, 2
Package Thermal Resistance, 44-pin QFN JA 32 — °C/W 1, 2
Package Thermal Resistance, 44-pin VTLA 
JA 30 — °C/W 1, 2
Note 1: Junction to ambient thermal resistance; Theta-
JA (JA) numbers are achieved by package simulations.
2: This package is available in dsPIC33FJ32(GP/MC)104 devices only.