Information

dsPIC33FJ06GS001/101A/102A/202A and dsPIC33FJ09GS302
DS80000540E-page 16  2012-2013 Microchip Technology Inc.
5. Module: Electrical Characteristics
In Table 25-43, the text for the Characteristics of
DA13 (V
RANGE) and DA14 (VLRANGE) is corrected
as follows (changes in bold):
• for DA13, Current Drive of 300 µA
• for DA14, Current Drive of 50 µA
6. Module: Packaging
A new packaging type, Ultra-Thin Quad Flat Pack
No Lead, 6 mm x 6 mm x 0.5 mm (UQFN), was
added for the dsPIC33FJ09GS302 28-pin device.
The 28-pin UQFN package shares the same pin
configurations as the existing 28-pin QFN-S
packages. Users may refer to the existing QFN pin
diagrams at the front of the device data sheet for
the appropriate pin configurations.
The format of package marking in Section 27.1
“Package Marking Information” is identical to that
of the existing 28-pin QFN-S packaging. The sole
difference is that UQFN packages are marked “/MX”
in the second line, instead of “/MM” for QFN-S
devices.
The following additions are made to the device
data sheet:
• Microchip Technology Drawing C04-0209A,
three sheets (“28-Lead Plastic Ultra-Thin
Quad Flat, No Lead Package”) are added by
reference to Section 27.2 “Packaging
Details”. The latest version of these drawings
is in Microchip Technology document
DS00049, “Packaging Specification”,
available at the Microchip web site, at
www.microchip.com/packaging.
• The data sheet Product Information System is
amended to add package type “MX, Plastic
Ultra-Thin Quad Flat, No Lead Package –
6 mm x 6 mm x 0.5 mm (UQFN).”